Robert Cohen of DoubleLine said Wednesday that AI-driven debt could reach bubble levels within the credit markets [1].

The warning comes as companies aggressively fund artificial intelligence initiatives, potentially decoupling debt loads from actual productivity gains. If these investments fail to yield expected returns, the resulting credit instability could impact broader financial markets.

Speaking at the Bloomberg Global Credit Forum in New York, Cohen, who serves as the Director of Global Developed Credit at DoubleLine, said the current corporate fundraising environment [2]. He focused on the intersection of private credit and the massive capital requirements associated with AI development [1].

Cohen said that the wave of AI-funded debt poses a specific risk to the high-grade credit market [3]. However, he also said that high-quality companies currently maintain strong balance sheets, and consistent cash flow [1]. This suggests a divide between speculative AI ventures and established firms with the liquidity to absorb the costs of new technology.

Private credit has become a central part of this funding surge. The ability for companies to bypass traditional public markets allows for faster capital deployment, though it may obscure the total level of risk being assumed by lenders [2].

Cohen used the panel discussion to advise investors on identifying potential opportunities while remaining wary of the funding wave [3]. He said that while the technology is transformative, the financial structures supporting it must remain sustainable to avoid a systemic correction [1].

AI-driven debt could reach bubble levels

This warning highlights a growing tension in the financial sector between the urgent need to fund AI infrastructure and the long-term stability of corporate debt. While established companies are well-positioned, a bubble in AI-specific credit could lead to a sharp correction if the technology does not deliver immediate profitability, potentially mirroring previous cycles of over-investment in emerging tech.