Intel and 3DGS will invest approximately $3.3 billion [1] to establish a substrate manufacturing plant in Odisha, India.
The project aims to introduce advanced substrate manufacturing technology to the region. By building this facility, the companies intend to strengthen the domestic chip ecosystem and reduce reliance on imported semiconductor components.
The announcement involved key leadership from both the private sector and the Indian government. Intel CEO Lip-Bu Tan and representatives from 3DGS coordinated the initiative with Union Minister of Electronics and IT Ashwini Vaishnaw and Odisha Chief Minister Mohan Charan Majhi.
Substrates are critical components in the semiconductor packaging process, acting as the foundation that connects the silicon chip to the printed circuit board. The facility in eastern India will focus on producing these essential materials to support the broader semiconductor supply chain.
The investment of $3.3 billion [1] represents a significant commitment to the industrial growth of Odisha. This move aligns with national efforts to position India as a global hub for electronics manufacturing, and semiconductor design.
Government officials in Odisha and the Union Ministry of Electronics and IT have expressed support for the venture. The collaboration is designed to foster technical expertise within the local workforce and attract further high-tech investment to the state.
“Intel and 3DGS will invest approximately $3.3 billion to establish a substrate manufacturing plant in Odisha, India.”
This investment signals a strategic shift toward diversifying the semiconductor supply chain away from traditional hubs. By focusing on substrate manufacturing—a critical but often overlooked part of the chip process—India is attempting to move up the value chain from simple assembly to high-tech component fabrication.
